Standard processes
Our performance contains all necessary aspects for the successful integration of microtechnology into your product.
 
Lithography
  • Aligned lithography
  • Double sided lithography
  • Positive-/ negative resist
  • Lift-off resist
  • Resolution limit < 1 micrometer
Deposition
  • PECVD
  • Thermal oxidation
  • Evaporation
  • Sputtering
Etching (wet and dry)
  • Metals
  • Silicon
  • SiO2; Si3N4; SiC
Analytics
  • SEM/ EDX
  • AFM
   Chip with microstructures